Highspeed Multi-Module Plattform with up to 4 Process Stations.
The Fusion Selective Soldering Concept offers fully integrated Inline soldering with two ,three or four Process Stations.
Features
Features
- For PCB sizes up to 381 mm x 460 mm
- Easy adaptable for different Applications
- Useable for Inline and Stand Alone Prozesses
- Integrated Drop-Jet-Fluxer
- Ultrasonic Fluxhead for spezial Applications
- Automatic Solder Nozzle Conditioning
- Inert soldering atmosphere with low nitrogen consumption
- Control system with self-diagnostic
Options
- Micro Soldernozzles down to 1,2 mm
- IR PCB Topside Preaheat
- IR PCB Bottomside Preheat
- Pyrometer PCB Temperatur Measurement
- Measuring and Control of Solder Wave Height
- Laser based PCB Warp correction
- PillarPad Offline-Programing System
Request detailed product overview
Your personal Contact Person
Wolfgang Riedel
Phone: +49 (0) 2622-943733
Fax: +49 (0) 2622-943750
E-Mail: w.riedel@rubroeder.de